收稿日期: 2014-01-27
修回日期: 2014-04-18
网络出版日期: 2015-01-15
基金资助
国家自然科学基金(51176201)和973ITER项目(2013GB114001)资助
Molecular dynamics simulation of thermal transport process of liquid metal
Received date: 2014-01-27
Revised date: 2014-04-18
Online published: 2015-01-15
张龙艳 , 王增辉 . 液态金属热输运过程的分子动力学模拟[J]. 中国科学院大学学报, 2015 , 32(1) : 25 -30 . DOI: 10.7523/j.issn.2095-6134.2015.01.005
In order to study the thermal transport process of liquid metal in micro scale, liquid metal flow and heat transfer process between two constant-temperature plates is simulated by using molecular dynamics simulation method. Cu atoms are used in the two plates as different constant-temperature solid walls, and liquid metal Pb is arranged in initial alignment as FCC structure between the two plates. The simulation results show that the liquid metal temperature has a linear distribution between two plates. At different temperatures, thermal transport processes of liquid metal show linear temperature distributions and thermal conductivity of the liquid metal linearly increases with temperature. By exerting gravity acceleration, liquid metal does not show obvious natural convection temperature distribution because boundary resistance and viscous force of liquid metal suppress the natural convection of liquid metal in micro scale.
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