针对数据中心冷却引发的巨大能耗问题，提出一种可用于数据中心服务器冷却的大功率空冷式环路热管。通过大量对比实验，探究重力对该环路热管传热性能的影响。实验结果表明，所提出的梯度毛细结构以及对回流液体再冷却的方法能够有效改善大功率环路热管在不同重力模式下的传热性能。经过结构优化后的环路热管在重力辅助模式下的最大传热能力达950W，对应的系统总热阻低至0.1℃/W，且成功实现了逆重力模式下的运行。
To solve the problem of huge energy consumption caused by data center cooling, this paper proposes a high-power air-cooled loop heat pipe that can be used for data center server cooling. The effect of gravity on the heat transfer performance of the loop heat pipe was explored through a large number of comparative experiments. The experimental results show that the gradient capillary structure and the method of re-cooling the reflux liquid proposed in this paper can effectively improve the heat transfer performance of the high-power loop heat pipe in different gravity modes. The loop heat pipe with optimized structure has a maximum heat transfer capacity of 950 W and a minimum total thermal resistance of 0.1 ℃/W in gravity-assisted mode. In addition, the high-power loop heat pipe proposed in this paper successfully operated in the anti-gravity mode.
[1] Patankar S V. Airflow and cooling in a data center[J]. Journal of Heat Transfer, 2010, 132(7): 271-291. DOI:10.1115/1.4000703.
[2] Dayarathna M, Wen Y G, Fan R. Data center energy consumption modeling: a survey[J]. IEEE Communications Surveys & Tutorials, 2015, 18(1): 732-794. DOI:10.1109/COMST.2015.2481183.
[3] 程亨达, 陈焕新, 邵双全, 等. 数据中心冷却系统的综合COP评价[J]. 制冷学报, 2020, 41(6): 77-84. DOI:10.3969/j.issn.0253-4339.2020.06.077.
[4] Maydanik Y F. Loop heat pipes[J]. Applied Thermal Engineering, 2005, 25(5/6): 635-657. DOI:10.1016/j.applthermaleng.2004.07.010.
[5] Tang H, Tang Y, Wan Z P, et al. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling[J]. Applied Energy, 2018, 223: 383-400. DOI:10.1016/j.apenergy.2018.04.072.
[6] Gerasimov Y, Maydanik Y F. Heat pipe[Z]. USSR Inventors Certificate 449213, 1974.
[7] Gerasimov Y, Maidanik Y F, Shchegolev G T, et al. Low-temperature heat pipes with seperate channels for vapor and liquid[J]. Journal of Engineering Physics, 1975, 28: 683-685. DOI:10.1007/BF00867371.
[8] 贾月, 唐大伟. 一种热管散热器对大功率LED散热效果的研究[J]. 中国科学院研究生院学报, 2012, 29(1): 27-31. DOI:10.7523/j.issn.2095-6134.2012.1.004.
[9] Chernysheva M A, Yushakova S I, Maydanik Y F. Copper-water loop heat pipes for energy-efficient cooling systems of supercomputers[J]. Energy, 2014, 69: 534-542. DOI:10.1016/j.energy.2014.03.048.
[10] Zhou G H, Li J, Jia Z Z. Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module[J]. Applied Energy, 2019, 239: 859-875. DOI:10.1016/j.apenergy.2019.01.258.
[11] Vasiliev L, Lossouarn D, Romestant C, et al. Loop heat pipe for cooling of high-power electronic components[J]. International Journal of Heat and Mass Transfer, 2009, 52(1/2): 301-308. DOI:10.1016/j.ijheatmasstransfer.2008.06.016.
[12] Bai L Z, Guo J H, Lin G P, et al. Steady-state modeling and analysis of a loop heat pipe under gravity-assisted operation[J]. Applied Thermal Engineering, 2015, 83: 88-97. DOI:10.1016/j.applthermaleng.2015.03.014.
[13] Nakamura K, Odagiri K, Nagano H. Study on a loop heat pipe for a long-distance heat transport under anti-gravity condition[J]. Applied Thermal Engineering, 2016, 107: 167-174. DOI:10.1016/j.applthermaleng.2016.06.162.
[14] Zhou L, Qu Z G, Chen G, et al. One-dimensional numerical study for loop heat pipe with two-phase heat leak model[J]. International Journal of Thermal Sciences, 2019, 137: 467-481. DOI:10.1016/j.ijthermalsci.2018.12.019.
[15] Adoni A A, Ambirajan A, Jasvanth V S, et al. Theoretical and experimental studies on an ammonia-based loop heat pipe with a flat evaporator[J]. IEEE Transactions on Components and Packaging Technologies, 2010, 33(2): 478-87. DOI:10.1109/TCAPT.2010.2042056.
[16] Guo Y D, Lin G P, Bai L Z, et al. Experimental study on the supercritical startup of cryogenic loop heat pipes with redundancy design[J]. Energy Conversion and Management, 2016, 118: 353-363. DOI:10.1016/j.enconman.2016.04.022.
[17] Li J, Zhou G H, Tian T, et al. A new cooling strategy for edge computing servers using compact looped heat pipe[J]. Applied Thermal Engineering, 2021, 187:116599. DOI:10.1016/j.applthermaleng，2021.116599.
