在众多单晶金刚石抛光方法中，动态摩擦抛光(DFP)因其具有极高的去除速率而受到广泛关注。研究DFP过程中3种抛光参数(抛光载荷、抛光时间和抛光盘线速率)以及3种夹持方式(粘接式、镶嵌式和卡钳式)对单晶金刚石抛光效果的影响。结果表明：增大抛光载荷、抛光时间和抛光盘线速率，都会导致样品的质量损耗增加和表面粗糙度降低，并提升金刚石(400)面的衍射峰强度。在3种夹持方法中，粘接式夹持的去除速率最快，最高可达25.2 nm/h，镶嵌式夹持最慢，卡钳式夹持介于前二者之间。定义一个抛光评价参量K：K=ΔRa/Δm，即单位材料损耗量下获得的表面粗糙度改善。根据K值的变化，可将DFP过程划分为以“粗糙度改善”为主和以“质量损耗”为主的2个阶段，前者K值高于后者。抛光参数中，增加抛光盘线速率可以单调提高K值，而抛光载荷和抛光时间对K值存在复杂影响。
The dynamic friction polishing (DFP) method has received extensive attention due to its significantly high removal rate comparing with other single crystal diamond polishing methods. In this study, three parameters (polishing load, polishing time， and polishing plate linear velocity) and three clamping types (bonded, inlay, and caliper type) were studied on the influence on the samples’ surface roughness (Ra) improvement and the mass loss. The results showed that the increase of the mass loss and the reduction of roughness occurred with increasing the polishing load, the polishing time， and the polishing plate linear velocity, respectively. Whilst, the X-ray diffraction intensity of (400) crystalline surface of each polished sample was enhanced. Among the three clamping types, the bonded clamping type possessed the fastest removal rates, up to 25.2 nm/h. A polishing evaluation parameter, K, was defined as K=ΔRa/Δm, i.e., representing the improvement in surface roughness obtained per unit mass loss. According to variation of the parameter K, the DFP procedure could be divided into two stages, “the roughness improvement domination stage” and “the mass loss domination stage”, with the former having higher K values than the latter. K values increased monotonically with the increase of the polishing plate linear velocity, whilst they were influenced complicatedly by the polishing load and the polishing time.
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