收稿日期: 2002-12-31
网络出版日期: 2003-07-10
基金资助
supportedbytheNationalNaturalScienceFoundationofChina,theMinistryofScienceandTechnologyofChina(GrantG1999064505)andMax PlanckSocietyofGermany
Thermal Stability and Mechanical Behavior of Electrodeposited Nanocrystalline Copper
Received date: 2002-12-31
Online published: 2003-07-10
卢磊 , 王隆保 , 丁丙哲 , 卢柯 . 电解沉积纳米晶体Cu的热稳定性及机械性能研究(英文)[J]. 中国科学院大学学报, 2003 , 20(4) : 497 -503 . DOI: 10.7523/j.issn.2095-6134.2003.4.017
A bulk nanocrystalline (nc) pure copper with a high purity and a high density was synthesized by means of electrodeposition. An extreme extensibility (elongation exceeds 5000%) without strain hardening effect was observed when the nc Cu specimen was rolled at room temperature. Microstructure analysis suggests that the superplastic extensibility of the nc Cu originates from a deformation mechanism dominated by grain boundary activities rather than lattice dislocation. This behavior demonstrates new possibilities for scientific and technological advancements of nc materials. Meanwhile, the thermal stability and tensile properties of this nc Cu sample were investigated in this thesis.
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