电解沉积纳米晶体Cu的热稳定性及机械性能研究(英文)

doi:10.7523/j.issn.2095-6134.2003.4.017

中国科学院大学学报 ›› 2003, Vol. 20 ›› Issue (4): 497-503.DOI: 10.7523/j.issn.2095-6134.2003.4.017

电解沉积纳米晶体Cu的热稳定性及机械性能研究(英文)

卢磊, 王隆保, 丁丙哲, 卢柯

中国科学院金属研究所沈阳材料科学国家(联合)实验室沈阳110016

收稿日期:2002-12-31 发布日期:2003-07-10
作者简介:卢磊:在博士研究生学习期间,在国际著名刊物(如Science,ActaMater.等)上发表论文多篇,申请发明专利2项,曾荣获2000年度中国科学院院长奖学金特别奖,评为2002年度全国优秀博士学位论文.现主要研究块体纳米晶体材料的制备与力学性能.导师王隆保:主要从事特制储氢材料的研究.
基金资助:
supportedbytheNationalNaturalScienceFoundationofChina,theMinistryofScienceandTechnologyofChina(GrantG1999064505)andMax PlanckSocietyofGermany

Thermal Stability and Mechanical Behavior of Electrodeposited Nanocrystalline Copper

Lu Lei, Wang Longbao, Ding Bingzhe, Lu Ke

Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

Received:2002-12-31 Published:2003-07-10

摘要/Abstract

摘要：

采用电解沉积技术制备出无孔隙、无污染、微观应变很小的理想 "纳米晶体单质Cu样品.对电解沉积纳米晶体Cu进行冷轧处理,首次发现纳米晶体材料具有室温下的超塑延展性,在冷轧过程初始阶段样品有少量的加工硬化,当变形量达到一定程度时(ε >80 0 % ),加工硬化效应消失。恒定的晶粒尺寸,恒定的位错密度,以及恒定的硬度值,说明纳米晶体Cu的塑性变形机制由晶界行为所控制,并非位错运动机制。系统的研究了纳米晶体中微观应变对其热稳定性的影响,发现随纳米晶Cu样品中微观应变的增加,晶粒长大的起始温度升高,而微观应变释放的起始温度下降.

关键词: 纳米晶体材料, 铜, 热稳定性, 力学性能, 变形机理

Abstract:

A bulk nanocrystalline (nc) pure copper with a high purity and a high density was synthesized by means of electrodeposition. An extreme extensibility (elongation exceeds 5000%) without strain hardening effect was observed when the nc Cu specimen was rolled at room temperature. Microstructure analysis suggests that the superplastic extensibility of the nc Cu originates from a deformation mechanism dominated by grain boundary activities rather than lattice dislocation. This behavior demonstrates new possibilities for scientific and technological advancements of nc materials. Meanwhile, the thermal stability and tensile properties of this nc Cu sample were investigated in this thesis.

Key words: nanocrystalline materials, copper, thermal stability, mechanical properties, deformation mechanism

中图分类号:

O743.2

卢磊, 王隆保, 丁丙哲, 卢柯. 电解沉积纳米晶体Cu的热稳定性及机械性能研究(英文)[J]. 中国科学院大学学报, 2003, 20(4): 497-503.

Lu Lei, Wang Longbao, Ding Bingzhe, Lu Ke. Thermal Stability and Mechanical Behavior of Electrodeposited Nanocrystalline Copper[J]. , 2003, 20(4): 497-503.

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电解沉积纳米晶体Cu的热稳定性及机械性能研究(英文)

Thermal Stability and Mechanical Behavior of Electrodeposited Nanocrystalline Copper

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