Ｅｘｐｅｒｉｍｅｎｔａｌｉｎｖｅｓｔｉｇａｔｉｏｎａｎｄｆｉｎｉｔｅｅｌｅｍｅｎｔｓｉｍｕｌａｔｉｏｎｏｎｇｒａｉｎ ｒｅｆｉｎｅｍｅｎｔｏｆｃｏｐｐｅｒｄｕｅｔｏｓｈｏｔｐｅｅｎｉｎｇ

ＬＡＮＪｉａｏ Ｘｉａ; ＷＡＮＧＺｈｉ Ｊｉａ; ＨＯＮＧＹｏｕ Ｓｈｉ

doi:10.7523/j.issn.2095-6134.2008.2.005

Journal of University of Chinese Academy of Sciences >

2008 , Vol. 25 >Issue 2: 172 - 176

DOI: https://doi.org/10.7523/j.issn.2095-6134.2008.2.005

论文

Ｅｘｐｅｒｉｍｅｎｔａｌｉｎｖｅｓｔｉｇａｔｉｏｎａｎｄｆｉｎｉｔｅｅｌｅｍｅｎｔｓｉｍｕｌａｔｉｏｎｏｎｇｒａｉｎｒｅｆｉｎｅｍｅｎｔｏｆｃｏｐｐｅｒｄｕｅｔｏｓｈｏｔｐｅｅｎｉｎｇ

ＬＡＮＪｉａｏＸｉａ ,
ＷＡＮＧＺｈｉＪｉａ ,
ＨＯＮＧＹｏｕＳｈｉ

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Received date: 1900-01-01

Revised date: 1900-01-01

Online published: 2008-03-15

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Abstract

ＡｂｓｔｒａｃｔＳｈｏｔＰｅｅｎｉｎｇ（ＳＰ）ｉｓａｔｙｐｉｃａｌｓｅｖｅｒｅｐｌａｓｔｉｃｄｅｆｏｒｍａｔｉｏｎｍｅｔｈｏｄｔｏｐｒｏｄｕｃｅｕｌｔｒａｆｉｎｅｇｒａｉｎｓｏｆｍｅｔａｌｌｉｃｍａｔｅｒｉａｌｓ．Ａｎｅｘｐｅｒｉｍｅｎｔａｌｉｎｖｅｓｔｉｇａｔｉｏｎｉｓｃａｒｒｉｅｄｏｕｔｏｎｐｕｒｅｃｏｐｐｅｒｓｐｅｃｉｍｅｎｓｂｙｍｅａｎｓｏｆａｓｈｏｔｐｅｅｎｉｎｇｍａｃｈｉｎｅｄｒｉｖｅｎｂｙｈｉｇｈｅｎｅｒｇｙａｉｒｐｒｅｓｓｕｒｅ，ａｓｕｒｆａｃｅｒｏｕｇｈｎｅｓｓｍｅａｓｕｒｍｅｎｔｔｅｓｔｅｒ，ａｍｉｃｒｏｈａｒｄｎｅｓｓｉｎｄｅｎｔｅｒ，ａｎｏｐｔｉｃａｌｍｉｃｒｏｓｃｏｐｅａｎｄａｓｃａｎｎｉｎｇｅｌｅｃｔｒｏｎｍｉｃｒｏｓｃｏｐｅｅｑｕｉｐｐｅｄｗｉｔｈｅｌｅｃｔｒｉｃａｌｂａｃｋｓｃａｔｔｅｒｄｉｆｆｒａｃｔｉｏｎａｐｐａｒａｔｕｓ．Ｔｈｅｒｅｓｕｌｔｓｓｈｏｗｅｄｔｈａｔｓｕｒｆａｃｅｒｏｕｇｈｎｅｓｓｔａｋｅｓｏｎａｎｅｘｐｏｎｅｎｔｉａｌｄｅｃａｙｗｉｔｈｄｉｓｐｏｓａｌｔｉｍｅ，ａｎｄｔｈａｔｔｈｅｇｒａｉｎｓｉｚｅｉｎｔｈｅｓｐｅｃｉｍｅｎｓｗｉｔｈ１３３３３ｓｉｓ２５２ｍｉｃｒｏｎｓｃｏｍｐａｒｅｄｗｉｔｈｔｈｅｏｒｉｇｉｎａｌｖａｌｕｅｏｆ２５４８ｍｉｃｒｏｎｓ，ｉ．ｅ．ｉｔｉｓｒｅｆｉｎｅｄｂｙｏｎｅｏｒｄｅｒｏｆｍａｇｎｉｔｕｄｅ．Ｔｈｅｍｉｃｒｏｈａｒｄｎｅｓｓｔｅｓｔｉｎｇｏｎｔｈｅｓｐｅｃｉｍｅｎｓｈｏｗｅｄｔｈｅｈａｒｄｎｅｓｓｉｎｃｒｅａｓｅｄｆｒｏｍ０.５８ＧＰａｔｏ１.２５ＧＰａａｆｔｅｒＳＰｔｒｅａｔｍｅｎｔ．Ｏｎｔｈｅｏｔｈｅｒｈａｎｄ，ａｄｉｍｅｎｓｉｏｎａｌａｎａｌｙｓｉｓｉｓｐｅｒｆｏｒｍｅｄｔｏｅｘａｍｉｎｅＳＰ
ｐｒｏｃｅｓｓｓｏｔｈａｔｔｏｏｂｔａｉｎｆｉｖｅｄｉｍｅｎｓｉｏｎｌｅｓｓｐａｒａｍｅｔｅｒｓａｎｄｔｈｅｍｅｔｈｏｄｏｆｆｉｎｉｔｅｅｌｅｍｅｎｔｓｉｍｕｌａｔｉｏｎｉｓｕｓｅｄｔｏａｎａｌｙｚｅｔｈｅｅｆｆｅｃｔｏｆｄｉｍｅｎｓｉｏｎｌｅｓｓｐａｒａｍｅｔｅｒｓｏｎｓｕｒｆａｃｅｒｏｕｇｈｎｅｓｓ．ＩｎｏｒｄｅｒｔｏｆｕｒｔｈｅｒｕｎｄｅｒｓｔａｎｄＳＰｐｒｏｃｅｓｓ，ｗｅｕｓｅｄＶＢ
ｔｏｗｒｉｔｅｔｈｅｓｕｂｐｒｏｇｒａｍｆｏｒｔｈｅｒａｎｄｏｍｉｍｐａｃｔｓｉｍｕｌａｔｉｏｎ，ｗｈｉｃｈｔｈｅｎｉｎｃｏｒｐｏｒａｔｅｄｗｉｔｈｆｉｎｉｔｅｅｌｅｍｅｎｔｃｏｄｅＡｎｓｙｓ/ｌｓ-ｄｙｎａｓｏａｓｔｏｓｉｍｕｌａｔｅｔｈｅｃｏｌｌｉｓｉｏｎｐｒｏｃｅｓｓｂｅｔｗｅｅｎｂａｌｌｓａｎｄｓａｍｐｌｅ．Ａｎｄｓｉｍｕｌａｔｅｄｒｅｓｕｌｔｓａｎｄｅｘｐｅｒｉｍｅｎｔａｌｒｅｓｕｌｔｓｗｅｒｅｃｏｍｐａｒｅｄｔｏｖｅｒｉｆｙｔｈｅｆｉｎｉｔｅｅｌｅｍｅｎｔｍｏｄｅｌ．

Key words： ｓｈｏｔｐｅｅｎｉｎｇ; ｆｉｎｉｔｅｅｌｅｍｅｎｔｓｉｍｕｌａｔｉｏｎ; ｃｏｐｐｅｒ; ｄｉｍｅｎｓｉｏｎａｌａｎａｌｙｓｉｓ; ｓｅｖｅｒｅｐｌａｓｔｉｃｄｅｆｏｒｍａｔｉｏｎ

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ＬＡＮＪｉａｏＸｉａ , ＷＡＮＧＺｈｉＪｉａ , ＨＯＮＧＹｏｕＳｈｉ . Ｅｘｐｅｒｉｍｅｎｔａｌｉｎｖｅｓｔｉｇａｔｉｏｎａｎｄｆｉｎｉｔｅｅｌｅｍｅｎｔｓｉｍｕｌａｔｉｏｎｏｎｇｒａｉｎｒｅｆｉｎｅｍｅｎｔｏｆｃｏｐｐｅｒｄｕｅｔｏｓｈｏｔｐｅｅｎｉｎｇ[J]. Journal of University of Chinese Academy of Sciences, 2008 , 25(2) : 172 -176 . DOI: 10.7523/j.issn.2095-6134.2008.2.005

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