The dynamic friction polishing (DFP) method has received extensive attention due to its significantly high removal rate comparing with other single crystal diamond polishing methods. In this study, three parameters (polishing load, polishing time, and polishing plate linear velocity) and three clamping types (bonded, inlay, and caliper type) were studied on the influence on the samples’ surface roughness (Ra) improvement and the mass loss. The results showed that the increase of the mass loss and the reduction of roughness occurred with increasing the polishing load, the polishing time, and the polishing plate linear velocity, respectively. Whilst, the X-ray diffraction intensity of (400) crystalline surface of each polished sample was enhanced. Among the three clamping types, the bonded clamping type possessed the fastest removal rates, up to 25.2 nm/h. A polishing evaluation parameter, K, was defined as K=ΔRa/Δm, i.e., representing the improvement in surface roughness obtained per unit mass loss. According to variation of the parameter K, the DFP procedure could be divided into two stages, “the roughness improvement domination stage” and “the mass loss domination stage”, with the former having higher K values than the latter. K values increased monotonically with the increase of the polishing plate linear velocity, whilst they were influenced complicatedly by the polishing load and the polishing time.
ZHANG Haochen
,
XU Kai
,
YAN Zengyu
,
SONG Zhipeng
,
CHEN Guangchao
. Dynamic friction polishing of single crystal diamond[J]. Journal of University of Chinese Academy of Sciences, 2024
, 41(5)
: 604
-611
.
DOI: 10.7523/j.ucas.2023.003
[1] Rani D, Opaluch O R, Neu E. Recent advances in single crystal diamond device fabrication for photonics, sensing and nanomechanics[J]. Micromachines, 2020, 12(1):36. DOI:10.3390/mi12010036.
[2] Wang Y F, Wang W, Wei J J, et al. Electrochemical route to bio-compatible fluorine-terminated diamond surface[J]. Carbon, 2021, 176:83-87. DOI:10.1016/j.carbon.2021.01.017.
[3] Li J J, Li B, Zuo Y G, et al. Application of dual radio frequency inductive coupled plasma into CVD diamond growth[J]. Vacuum, 2018, 154:174-176. DOI:10.1016/j.vacuum.2018.04.054.
[4] Yamada H, Chayahara A, Mokuno Y, et al. A 2-in. mosaic wafer made of a single-crystal diamond[J]. Applied Physics Letters, 2014, 104(10):102110. DOI:10.1063/1.4868720.
[5] Schreck M, Gsell S, Brescia R, et al. Ion bombardment induced buried lateral growth:the key mechanism for the synthesis of single crystal diamond wafers[J]. Scientific Reports, 2017, 7:44462. DOI:10.1038/srep44462.
[6] 吕反修,李成明.我国化学气相沉积(CVD)金刚石膜研究三十年[J].人工晶体学报, 2022, 51(5):753-758. DOI:10.16553/j.cnki.issn1000-985x.2022.05.005.
[7] Hou P Y, Zhou M, Zhang H J. Thermal behavior of single-crystal diamonds catalyzed by titanium alloy at elevated temperature[J]. Applied Sciences, 2020, 10(13):4651. DOI:10.3390/app10134651.
[8] 李小波,唐大伟,祝捷.纳米金刚石颗粒导热系数的分子动力学研究[J].中国科学院研究生院学报, 2008, 25(5):598-601. DOI:10.7523/j.issn.2095-6134. 2008.5.004.
[9] Golter D A, Oo T, Amezcua M, et al. Optomechanical quantum control of a nitrogen-vacancy center in diamond[J]. Physical Review Letters, 2016, 116(14):143602. DOI:10.1103/PhysRevLett.116.143602.
[10] Turunen M, Brotons-Gisbert M, Dai Y Y, et al. Quantum photonics with layered 2D materials[J]. Nature Reviews Physics, 2022, 4(4):219-236. DOI:10.1038/s42254-021-00408-0.
[11] Feng H B, Chen Y Q, Zhang L C. Polishing of CVD diamond wafers and films[J]. Key Engineering Materials, 2012, 531/532:373-376. DOI:10.4028/www.scientific.net/kem.531-532.373.
[12] 温海浪,肖平,陆静.大尺寸单晶金刚石衬底抛光技术研究现状与展望[J].机械工程学报, 2021, 57(22):157-171. DOI:10.3901/JME.2021.22.157.
[13] Chen Y, Zhang L C, Tang F. Surface integrity of PCD composites generated by dynamic friction polishing:effect of processing conditions[J]. Diamond and Related Materials, 2012, 26(6):25-31. DOI:10.1016/j.diamond.2012.04.002.
[14] Luo H, Ajmal K M, Liu W, et al. Polishing and planarization of single crystal diamonds:state of the art and perspectives[J]. International Journal of Extreme Manufacturing, 2021, 3(2):44-91. DOI:10.1088/2631-7990/abe915.
[15] Suzuki K, Iwai M, Uematsu T, et al. Material removal mechanism in dynamic friction polishing of diamond[J]. Key Engineering Materials, 2003, 238-239(3):235-240. DOI:10.4028/www.scientific.net/kem.238-239.235.
[16] Chen Y, Zhang L C, Arsecularatne J A. Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2:Material removal mechanism[J]. International Journal of Machine Tools and Manufacture, 2007, 47(10):1615-1624. DOI:10.1016/j.ijmachtools.2006.11.003.
[17] Chen Y Q, Zhang L C. Fast polishing of single crystal diamond[J]. Advanced Materials Research, 2010, 97-101(6):4096-4099. DOI:10.4028/www.scientific.net/AMR.97-101.4096.
[18] Shi S J, Jin Z J, Zhong X H, et al. Processing and mechanism of dynamic friction polishing diamond using manganese-based alloy[J]. Materials and Manufacturing Processes, 2015, 30(5):654-660. DOI:10.1080/10426914.2014.952033.
[19] Jin Z J, Shi S J, Lin J Z, et al. Preparation and performance of dynamic friction polishing plate for diamond film[J]. Materials and Manufacturing Processes, 2014, 29(1):20-26. DOI:10.1080/10426914. 2013.852219.
[20] Zheng Y T, Cumont A E L, Bai M J, et al. Smoothing of single crystal diamond by high-speed three-dimensional dynamic friction polishing:optimization and surface bonds evolution mechanism[J]. International Journal of Refractory Metals and Hard Materials, 2021, 96:105472. DOI:10.1016/j.ijrmhm.2021.105472.