液态金属热输运过程的分子动力学模拟

doi:10.7523/j.issn.2095-6134.2015.01.005

摘要/Abstract

摘要：

采用分子动力学模拟方法对平板间液态金属的流动换热过程进行模拟.研究液态金属的微观热输运过程,左右两侧平板采用Cu原子作为恒温固壁,液态金属Pb处于平板间,以FCC结构为初始排列.模拟结果表明,在平板间的液态金属温度分布呈线性变化;不同温度下液态金属在恒温平板间的热输运模拟过程表明,平板间液态金属的热导率随温度的升高而增加,呈现线性变化.当在系统上施加一个重力加速度时,平板间未出现明显的自然对流,表明在微尺度下,边界阻力和粘滞力抑制了液态金属的自然对流.

关键词: 分子动力学模拟, 热输运, 热导率, 液态金属

Abstract:

In order to study the thermal transport process of liquid metal in micro scale, liquid metal flow and heat transfer process between two constant-temperature plates is simulated by using molecular dynamics simulation method. Cu atoms are used in the two plates as different constant-temperature solid walls, and liquid metal Pb is arranged in initial alignment as FCC structure between the two plates. The simulation results show that the liquid metal temperature has a linear distribution between two plates. At different temperatures, thermal transport processes of liquid metal show linear temperature distributions and thermal conductivity of the liquid metal linearly increases with temperature. By exerting gravity acceleration, liquid metal does not show obvious natural convection temperature distribution because boundary resistance and viscous force of liquid metal suppress the natural convection of liquid metal in micro scale.

Key words: molecular dynamics simulation, heat transfer, thermal conductivity, liquid metal

中图分类号:

TK124

张龙艳, 王增辉. 液态金属热输运过程的分子动力学模拟[J]. 中国科学院大学学报, 2015, 32(1): 25-30.

ZHANG Longyan, WANG Zenghui. Molecular dynamics simulation of thermal transport process of liquid metal[J]. , 2015, 32(1): 25-30.

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