Molecular dynamics simulation of thermal transport process of liquid metal

doi:10.7523/j.issn.2095-6134.2015.01.005

Abstract

Abstract:

In order to study the thermal transport process of liquid metal in micro scale, liquid metal flow and heat transfer process between two constant-temperature plates is simulated by using molecular dynamics simulation method. Cu atoms are used in the two plates as different constant-temperature solid walls, and liquid metal Pb is arranged in initial alignment as FCC structure between the two plates. The simulation results show that the liquid metal temperature has a linear distribution between two plates. At different temperatures, thermal transport processes of liquid metal show linear temperature distributions and thermal conductivity of the liquid metal linearly increases with temperature. By exerting gravity acceleration, liquid metal does not show obvious natural convection temperature distribution because boundary resistance and viscous force of liquid metal suppress the natural convection of liquid metal in micro scale.

Key words: molecular dynamics simulation, heat transfer, thermal conductivity, liquid metal

CLC Number:

TK124

ZHANG Longyan, WANG Zenghui. Molecular dynamics simulation of thermal transport process of liquid metal[J]. , 2015, 32(1): 25-30.

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