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Journal of University of Chinese Academy of Sciences ›› 2024, Vol. 41 ›› Issue (1): 42-49.DOI: 10.7523/j.ucas.2022.049

• Research Articles • Previous Articles     Next Articles

Curing process of 1,3-di(2'-aminoethyl)-2-methylimidazolium bromide with epoxy resin E-51

SU Ze1,3, BAI Jinhu2, WU Qiong3, LIU Long2, ZHANG Yanqiang2,3   

  1. 1. Henan Institute of Advanced Technology, Zhengzhou University, Zhengzhou 450001, China;
    2. CAS Key Laboratory of Science and Technology on Particle Materials, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China;
    3. Zhengzhou Institute of Emerging Industrial Technology, Zhengzhou 450000, China
  • Received:2022-03-28 Revised:2022-04-29 Online:2024-01-15

Abstract: A diaminoimidazole ionic liquid curing agent, 1,3-di(2'-aminoethyl)-2-methylimidazolium bromide (DAIL) is prepared via quaternization of imidazole rings. With epoxy resin E-51 as matrix resin, the curing process conditions of DAIL as curing agent and the properties of cured products are studied in depth. The results show that DAIL can be used as a medium temperature curing agent for epoxy resins. The optimal ratio of the two is DAIL∶E-51=20∶100, the optimal curing temperature range is 74~105 ℃, and the post-curing temperature is 162 ℃. The tensile strength of the cured cast body splines is 159 MPa, the elastic modulus is 2 281 MPa, and the elongation at break is 12.8%, the thermal decomposition temperature is 424.4 ℃. DMA analysis shows that the maximum loss factor tanδ of the DAIL/E-51 cast body is 0.56, and the glass transition temperature θg is 83 ℃, the corresponding storage modulus E is 290 MPa, and the crosslinking density is 30 149 mol·m-3. This study provides an important experimental basis for the use of high mechanical properties of medium temperature epoxy resin curing agent.

Key words: 1,3-di (2'-aminoethyl)-2-methylimidazolium bromide, epoxy resin, curing agent, curing principle, curing kinetics

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