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Journal of University of Chinese Academy of Sciences ›› 2024, Vol. 41 ›› Issue (5): 604-611.DOI: 10.7523/j.ucas.2023.003

• Research Articles • Previous Articles    

Dynamic friction polishing of single crystal diamond

ZHANG Haochen, XU Kai, YAN Zengyu, SONG Zhipeng, CHEN Guangchao   

  1. College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 101400, China
  • Received:2022-09-08 Revised:2023-01-09

Abstract: The dynamic friction polishing (DFP) method has received extensive attention due to its significantly high removal rate comparing with other single crystal diamond polishing methods. In this study, three parameters (polishing load, polishing time, and polishing plate linear velocity) and three clamping types (bonded, inlay, and caliper type) were studied on the influence on the samples’ surface roughness (Ra) improvement and the mass loss. The results showed that the increase of the mass loss and the reduction of roughness occurred with increasing the polishing load, the polishing time, and the polishing plate linear velocity, respectively. Whilst, the X-ray diffraction intensity of (400) crystalline surface of each polished sample was enhanced. Among the three clamping types, the bonded clamping type possessed the fastest removal rates, up to 25.2 nm/h. A polishing evaluation parameter, K, was defined as KRam, i.e., representing the improvement in surface roughness obtained per unit mass loss. According to variation of the parameter K, the DFP procedure could be divided into two stages, “the roughness improvement domination stage” and “the mass loss domination stage”, with the former having higher K values than the latter. K values increased monotonically with the increase of the polishing plate linear velocity, whilst they were influenced complicatedly by the polishing load and the polishing time.

Key words: single crystal diamond, dynamic friction polishing (DFP), roughness, mass loss, clamping type

CLC Number: