Thermal Stability and Mechanical Behavior of Electrodeposited Nanocrystalline Copper

doi:10.7523/j.issn.2095-6134.2003.4.017

Abstract

Abstract:

A bulk nanocrystalline (nc) pure copper with a high purity and a high density was synthesized by means of electrodeposition. An extreme extensibility (elongation exceeds 5000%) without strain hardening effect was observed when the nc Cu specimen was rolled at room temperature. Microstructure analysis suggests that the superplastic extensibility of the nc Cu originates from a deformation mechanism dominated by grain boundary activities rather than lattice dislocation. This behavior demonstrates new possibilities for scientific and technological advancements of nc materials. Meanwhile, the thermal stability and tensile properties of this nc Cu sample were investigated in this thesis.

Key words: nanocrystalline materials, copper, thermal stability, mechanical properties, deformation mechanism

CLC Number:

O743.2

Lu Lei, Wang Longbao, Ding Bingzhe, Lu Ke. Thermal Stability and Mechanical Behavior of Electrodeposited Nanocrystalline Copper[J]. , 2003, 20(4): 497-503.

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